LI Hui Institute of Metal Research
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Academia Sinica
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Shenyang
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ChinaLIU Xiang Northeast Institute of Technology
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Shenyang
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ChinaGUO Jianting HU Zhuangqi Institute of Metal Research
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Academia Sinica
,
Shenyang
,
China Associate Professor
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Institute of Metall Research
,
Academia Sinica
,
Shenyang
,
China
金属学报(英文版)
By means of nonstoichiometry,rapid solidification and adequate boron addition,the tensile strength and bending resistance of Ni_3Al has been improved.When adding 0.52 to 1.37 at.-% B into Ni_3Al,which has the beneficial effect on the ductility.If boron addition is too high, there are coarse Ni_(23)B_6 particles and NiB_(12) phases found at the grain boundaries.Boron modification in Ni_3Al promotes the ordering in the region near grain boundaries.The grain boundary of boron free Ni_3Al is a large angle one,but turns into a small angle grain bound- ary with sub-grains of dislocation characteristics when the boron content in Ni_3Al reaches 1.37 at.-%.
关键词:
intermetallic compound
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null
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WAGENDRISTEL A Viena Technical Univessity
,
AustriaHUANG Rongfang Institute of Metal Research
,
Academia Sinica
,
Shenyang
,
ChinaBANGERT H YANG Xia WU Lihang WANG Haifeng PANGRATZ H SKALICKY P Viena Technical University
,
Austria Associate Professor
,
Institute of Metall Research
,
Academia Sinica
,
Shenyang 110015
,
China
金属学报(英文版)
The microstructure of Ti/TiN multilayer film was studied.It was shown by trans- mission electron microscopy of cross-sectional sample and respective secondary neutrals mass-spectroscopy depth profiling that the film has a periodic alternate multilayered structure:substrate /FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TiN...Ti/Ti_2N/TiN,where FeTi and Ti_2N were the transition layers formed during ion plating.Cross-sectional fracture surface of indentation samples had been obtained and studied with scanning electron microscopy.It was shown that the multilayer film deformed during indentation, formed an indentation pit and a pile-up of materials around the indentation pit.As the applied load increased deformation region extended beyond the film/substratc interface and into the substrate,the interlayer crack in the film and hole formation at the film /substrate interface were initiated.It is also shown that the multilayered Ti/TiN film offered better toughness in comparison with single layer TiN film.
关键词:
multilayer Ti-N film
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